Mixed orientation Si-Si interfaces by hydrophilic bonding and high temperature oxide dissolution: Wafer fabrication technique and device applications
- K.L. Saenger
- J.P. De Souza
- et al.
- 2007
- ECS Meeting 2007
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51 results for Alexander Reznicek
Substrate engineering for germanium-based CMOS technology
- S.W. Bedell
- K.E. Fogel
- et al.
- 2006
- ECS Meeting 2006
Advanced applications of semiconductor epitaxy for cutting edge integrated circuit technology
- D.K. Sadana
- M. Yang
- et al.
- 2006
- ECS Meeting 2006
High mobility channels for ultimate CMOS
- D.K. Sadana
- S.J. Koester
- et al.
- 2006
- ECS Meeting 2006
Single wafer sSOI by SIMOX
- J.P. De Souza
- S.W. Bedell
- et al.
- 2006
- ISTDM 2006
Development of stacking faults in strained silicon layers
- S.W. Bedell
- A. Reznicek
- et al.
- 2005
- IEEE International SOI Conference 2005
Characterization of ultra thin SOI and SSOI substrates: Defect and strain analysis
- S.W. Bedell
- H.J. Hovel
- et al.
- 2005
- ECS Meeting 2005
Strain engineering for silicon CMOS technology
- D.K. Sadana
- S.W. Bedell
- et al.
- 2005
- ECS Meeting 2005
300 mm SGOI/strain-Si for high-performance CMOS
- A. Reznicek
- S.W. Bedell
- et al.
- 2004
- IEEE International SOI Conference 2004
Strained-silicon / silicon-germanium-on-insulator for high-performance CMOS : A manufacturable process for 300 mm substrates
- A. Reznicek
- S.W. Bedell
- et al.
- 2004
- ECS Meeting 2004