An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- Katsuyuki Sakuma
- Krishna Tunga
- et al.
- 2015
- ECTC 2015
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3 results for Koushik Ramachandran
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
3D integration ESD protection design and analysis
- Souvick Mitra
- Ephrem Gebreselasie
- et al.
- 2015
- EOS/ESD 2015