Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
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4 results for Sakti P. Ghosh
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
An application of statistical databases in manufacturing testing
- Sakti P. Ghosh
- 1984
- ICDE 1984
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015