Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
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Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- Jonas Zürcher
- Xi Chen
- et al.
- 2015
- NANO 2015