Sub-30nm scaling and high-speed operation of fully-confined Access-Devices for 3D crosspoint memory based on mixed-ionic-electronic-conduction (MIEC) materials
- K. Virwani
- G.W. Burr
- et al.
- 2012
- IEDM 2012
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6 results for Amy N. Bowers
Directed self-assembly of topcoat-free, integration-friendly high-χ block copolymers
- Eri Hirahara
- Margareta Paunescu
- et al.
- 2015
- SPIE Advanced Lithography 2015
Recovery dynamics and fast (sub-50ns) read operation with Access Devices for 3D crosspoint memory based on mixed-ionic-electronic-conduction (MIEC)
- G.W. Burr
- K. Virwani
- et al.
- 2013
- VLSI Technology 2013
Large-scale (512kbit) integration of multilayer-ready access-devices based on Mixed-Ionic-Electronic-Conduction (MIEC) at 100% yield
- G.W. Burr
- K. Virwani
- et al.
- 2012
- VLSI Technology 2012
Endurance and scaling trends of novel access-devices for multi-layer crosspoint-memory based on mixed-ionic-electronic-conduction (MIEC) materials
- R.S. Shenoy
- K. Gopalakrishnan
- et al.
- 2011
- VLSI Technology 2011
Highly scalable novel access device based on Mixed Ionic Electronic Conduction (MIEC) materials for high density phase change memory (PCM) arrays
- K. Gopalakrishnan
- R.S. Shenoy
- et al.
- 2010
- VLSI Technology 2010