Publications

63 results for Bing Dang

Integrated microfluidic cooling and interconnects for 2D and 3D chips
- - Bing Dang
  - Muhannad S. Bakir
  - et al.
- 2010
- IEEE Transactions on Advanced Packaging
Reliable through silicon vias for 3D silicon applications
- - M.J. Shapiro
  - M. Interrante
  - et al.
- 2009
- IITC 2009
C4NP technology: Present and future
- - Eric Perfecto
  - Da-Yuan Shih
  - et al.
- 2008
- GBC 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- - D.Y. Shih
  - B. Dang
  - et al.
- 2008
- ICEPT-HDP 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
3D stacking of chips with electrical and microfluidic I/O interconnects
- - Calvin R. King Jr.
  - Deepak Sekar
  - et al.
- 2008
- ECTC 2008
Reliability testing of through-silicon vias for high-current 3D applications
- - Steven L. Wright
  - Paul S. Andry
  - et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- - Bing Dang
  - Da-Yuan Shih
  - et al.
- 2008
- ECTC 2008
A 3D-IC technology with integrated microchannel cooling
- - Deepak Sekar
  - Calvin King
  - et al.
- 2008
- IITC 2008