Characterization of flip chip microjoins up to 40 GHz using silicon carrierChirag S. PatelPaul S. Andryet al.2005IITC 2005
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnectionJohn U. KnickerbockerPaul S. Andryet al.2005IBM J. Res. Dev
Optimal implementation of sea of leads (SoL) compliant interconnect technologyBing DangChirag Patelet al.2004IITC 2004