Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
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56 results for Katsuyuki Sakuma
Effects of excimer irradiation treatment on thermocompression Au-Au bonding
- Naoko Unami
- Katsuyuki Sakuma
- et al.
- 2010
- Japanese Journal of Applied Physics
Simplified 20-μm pitch vertical interconnection process for 3D chip stacking
- Katsuyuki Sakuma
- Noriyasu Nagai
- et al.
- 2009
- IEEJ Transactions on Electrical and Electronic Engineering
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev