Co-packaged optics module with single mode polymer waveguide
- Akihiro Horibe
- Yoichi Taira
- et al.
- 2025
- IEDM 2025
Publications
5 results for Hiroyuki Mori
Graphite sheet embedded in an organic flip-chip package for heat spreading
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- ECTC 2025
Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John Knickerbocker
- Jean Benoit Heroux
- et al.
- 2025
- ECTC 2025
Thermal and Mechanical Analysis of Embedded Liquid Cooling with Microchannel and Pin-fin Structures
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2024
- ITherm 2024
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023