3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
- Arvind Sridhar
- Alessandro Viricenzi
- et al.
- 2010
- ICCAD 2010
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152 results for Thomas Brunschwiler
Heat-removal performance scaling of interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2010
- ITherm 2010
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
- Ayse K. Coskun
- David Atienza
- et al.
- 2010
- DATE 2010
Hotspot-adapted cold plates to maximize system efficiency
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2009
- THERMINIC 2009
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- T. Brunschwiler
- S. Paredes
- et al.
- 2009
- 3DIC 2009
Design of thermal interfaces with embedded microchannels to control bond line formation
- Brian Smith
- Hugo Rothuizen
- et al.
- 2008
- ITherm 2008
Forced convective interlayer cooling in vertically integrated packages
- 2008
- ITherm 2008
High-performance thermal interface technology overview
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Utility of transient testing to characterize thermal interface materials
- B. Smith
- T. Brunschwiler
- et al.
- 2007
- THERMINIC 2007
Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
- R. Linderman
- T. Brunschwiler
- et al.
- 2007
- SEMI-THERM 2007