Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
- Christian Hofmann
- Mario Baum
- et al.
- 2015
- SSI 2015
Publications
156 results for Thomas Brunschwiler
Energy efficient hotspot-targeted embedded liquid cooling of electronics
- Chander Shekhar Sharma
- Manish K. Tiwari
- et al.
- 2015
- Applied Energy
In situ assembly in confined spaces of coated particle scaffolds as thermal underfills with extraordinary thermal conductivity
- Guo Hong
- Thomas M. Schutzius
- et al.
- 2014
- ACS AMI
Thermal characterization of percolating thermal underfills: Bulk and cavity
- Brian R. Burg
- Manuel Koilly
- et al.
- 2014
- THERMINIC 2014
Characterization of particle beds in percolating thermal underfills based on centrifugation
- Severin Zimmermann
- Thomas Brunschwiler
- et al.
- 2014
- 3DIC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
Wafer-level integration of embedded cooling approaches
- Stephan Paredes
- Yassir Madhour
- et al.
- 2014
- ISSWB 2014
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
- Arvind Sridhar
- Alessandro Vincenzi
- et al.
- 2014
- IEEE TC
Study of the compound of properties of percolating and neck-based thermal underfills
- Thomas Brunschwiler
- Florian Schindler-Saefkow
- et al.
- 2014
- ITherm 2014