Roadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- HPCS 2013
Publications
159 results for Thomas Brunschwiler
Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling
- Fabio Alfieri
- Sacha Gianini
- et al.
- 2013
- Numerical Heat Transfer; Part A: Applications
Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
- Ningkang Li
- Gerd Schlottig
- et al.
- 2013
- THERMINIC 2013
Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Int. J. Heat Mass Transf.
Roadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- DATE 2013
Vortex shedding from confined micropin arrays
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Microfluidics and Nanofluidics
Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- Yassir Madhour
- Thomas Brunschwiler
- et al.
- 2012
- ICEPT 2012
Centrifugal formulation of percolating thermal underfills for flip-chip applications
- Jonas Zuercher
- Javier V. Goicochea
- et al.
- 2012
- CIPS 2012