Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Int. J. Heat Mass Transf.
Publications
155 results for Thomas Brunschwiler
Roadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- DATE 2013
Vortex shedding from confined micropin arrays
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Microfluidics and Nanofluidics
Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
Centrifugal formulation of percolating thermal underfills for flip-chip applications
- Jonas Zuercher
- Javier V. Goicochea
- et al.
- 2012
- CIPS 2012
Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- Yassir Madhour
- Thomas Brunschwiler
- et al.
- 2012
- ICEPT 2012
Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
- Javier V. Goicochea
- Thomas Brunschwiler
- et al.
- 2012
- ITherm 2012
Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2012
- ITherm 2012
Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
- Manish K. Tiwari
- Severin Zimmermann
- et al.
- 2012
- ITherm 2012
Directed self-assembly of nanoparticles for novel electrical interconnects
- Yu Liu
- Gerd Schlottig
- et al.
- 2012
- ESTC 2012