Toward five-dimensional scaling: How density improves efficiency in future computers
- 2011
- IBM J. Res. Dev
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152 results for Thomas Brunschwiler
Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2011
- Experiments in Fluids
On the cooling of electronics with nanofluids
- W. Escher
- Thomas Brunschwiler
- et al.
- 2011
- Journal of Heat Transfer
Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
- W. Escher
- Thomas Brunschwiler
- et al.
- 2010
- Journal of Heat Transfer
Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics
- R. Wälchli
- Thomas Brunschwiler
- et al.
- 2010
- Journal of Heat Transfer
Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
- R. Wälchli
- Thomas Brunschwiler
- et al.
- 2010
- Int. J. Heat Mass Transf.
Antenna coupled far-infrared/THz detector in CMOS
- T. Morf
- Jonas Weiss
- et al.
- 2009
- Electronics Letters
Comparison of transient and static test methods for chip-to-sink thermal interface characterization
- B. Smith
- T. Brunschwiler
- et al.
- 2009
- Microelectronics Journal
Toward zero-emission data centers through direct reuse of thermal energy
- T. Brunschwiler
- B. Smith
- et al.
- 2009
- IBM J. Res. Dev
Interlayer cooling potential in vertically integrated packages
- 2008
- Microsystem Technologies