High-performance thermal interface technology overviewR. LindermanT. Brunschwileret al.2007THERMINIC 2007
Utility of transient testing to characterize thermal interface materialsB. SmithT. Brunschwileret al.2007THERMINIC 2007
Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfacesR. LindermanT. Brunschwileret al.2007SEMI-THERM 2007
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistanceThomas BrunschwilerUrs Kloteret al.2007IEEE Transactions on Components and Packaging Technologies
Direct liquid jet-impingement cooling with micronsized nozzle array and distributed return architectureThomas BrunschwilerHugo Rothuizenet al.2006ITherm 2006
Microchip cooling module based on FC72 slot jet arrays without cross-flowM. FabbriA. Wetteret al.2006SEMI-THERM 2006
Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistanceT. BrunschwilerU. Kloteret al.2005SEMI-THERM 2005
Polarization-independent thermooptic phase shifters in silicon-oxynitride waveguidesB.J. OffreinD. Jubinet al.2004IEEE Photonics Technology Letters
Hysteretic electroluminescence in organic light-emitting diodes for spin injectionG. SalisS.F. Alvaradoet al.2004Physical Review B - CMMP