Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
Publications
Date
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152 results for Thomas Brunschwiler
Investigation of novel solder patterns for power delivery and heat removal support
- Thomas Brunschwiler
- Yassir Madhour
- et al.
- 2013
- ECTC 2013
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- Fengda Sun
- Yusuf Leblebici
- et al.
- 2011
- ECTC 2011
Hotspot-optimized interlayer cooling in vertically integrated packages
- 2008
- MRS Fall Meeting 2008
4M4EO – Massively Multi-Modal Masked Autoencoders for Earth Observation
- 2024
- AGU 2024
TensorLakeHouse: A High-Performance, Open-Source Platform for Accelerated Geospatial Data Management with Hierarchical Statistical Indices
- Romeo Kienzler
- Leonardo P. Tizzei
- et al.
- 2024
- AGU 2024
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
- Arvind Sridhar
- Alessandro Vincenzi
- et al.
- 2014
- IEEE TC
Breathing New Life into COPD Assessment: Multisensory Home-monitoring for Predicting Severity
- Zixuan Xiao
- Michal Muszynski
- et al.
- 2023
- ICMI 2023
Multi-Spectral Remote Sensing Image Retrieval using Geospatial Foundation Models
- Benedikt Blumenstiel
- Viktoria Moor
- et al.
- 2024
- IGARSS 2024
Toward Foundation Models for Earth Monitoring: Generalizable Deep Learning Models For Natural Hazard Segmentation
- Johannes Jakubik
- Michal Muszynski
- et al.
- 2023
- IGARSS 2023