Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2012
- ITherm 2012
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152 results for Thomas Brunschwiler
Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
- Javier V. Goicochea
- Thomas Brunschwiler
- et al.
- 2012
- ITherm 2012
Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
- Manish K. Tiwari
- Severin Zimmermann
- et al.
- 2012
- ITherm 2012
Directed self-assembly of nanoparticles for novel electrical interconnects
- Yu Liu
- Gerd Schlottig
- et al.
- 2012
- ESTC 2012
A multivariate parameter analysis of copper pillars eases the design of denser interconnects
- Gerd Schlottig
- Thomas Brunschwiler
- et al.
- 2012
- EuroSimE 2012
Formulation of percolating thermal underfill by sequential convective gap filling
- Thomas Brunschwiler
- Javier V. Goicochea
- et al.
- 2011
- ISHVAC 2011
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2011
- SEMI-THERM 2011
Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
- Gözde Töral
- Roland Bender
- et al.
- 2010
- THERMINIC 2010
Direct waste heat utilization from liquid-cooled supercomputers
- 2010
- IHTC 2010
3D integrated water cooling of a composite multilayer stack of chips
- Fabio Alfieri
- Manish K. Tiwari
- et al.
- 2010
- IHTC 2010