Stress investigations in 3D-integrated silicon microstructures
- M. Stiebing
- Emanuel Lörtscher
- et al.
- 2016
- EuroSimE 2016
Publications
160 results for Thomas Brunschwiler
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
Lid-integral cold-plate topology: Integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2016
- ASME Journal of Electronic Packaging
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- Brian R. Burg
- Jonas Zürcher
- et al.
- 2015
- EMPC 2015
Steady-state low thermal resistance characterization apparatus: The bulk thermal tester
- Brian R. Burg
- Manuel Kolly
- et al.
- 2015
- Review of Scientific Instruments
Modeling and multi-objective optimization of 2.5D inductor-based Fully Integrated Voltage Regulators for microprocessor applications
- Pedro André Martins Bezerra
- Florian Krismer
- et al.
- 2015
- COBEP/SPEC 2015
A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
- Chander Shekhar Sharma
- Gerd Schlottig
- et al.
- 2015
- Int. J. Heat Mass Transf.
Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- Jonas Zürcher
- Xi Chen
- et al.
- 2015
- NANO 2015
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015