Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
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3 results for Akira Uedono
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- Takeshi Nogami
- C. Penny
- et al.
- 2012
- IEDM 2012
Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams
- Akira Uedono
- Takeshi Nogami
- et al.
- 2023
- Journal of Applied Physics