Reliable Chiplet integration on high density laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Pouliot-Grenier
- et al.
- 2024
- ECTC 2024
Publications
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6 results for Tom Wassick
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024
The impact of Al on contact resistance and its suitability in fine pitch interconnects
- Fee Li Lie
- Sathya Raghavan
- et al.
- 2023
- IMAPS 2023