Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
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3 results for Wei-Tsu Tseng
Metal Corrosion Mitigation in Fine Geometries during Chemical Mechanical Planarization
- Wei-Tsu Tseng
- Emiko Motoyama
- et al.
- 2024
- ECS Spring Meeting 2024
Post Tungsten CMP Cleaning: Optimization for Cleaning Efficiency and Corrosion Reduction
- Wei-Tsu Tseng
- Pinlei Chu
- et al.
- 2024
- ECS J. Solid State Sci. Technol.