Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
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4 results for Charles Arvin
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013
Assessment of XRF technique as a method to measure percent ag in SnAg solders for flip chip applications
- Jennifer D. Schuler
- Chia-Hsin Shih
- et al.
- 2012
- IMAPS 2012
Residual stress properties of nickel and copper deposits used for C4 interconnects
- Charles Arvin
- G.J. Scott
- et al.
- 2011
- ECS Meeting 2011