Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
- Xin Zhao
- Michael Scheuermann
- et al.
- 2012
- DAC 2012
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5 results for Sung Kyu Lim
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
- Xin Zhao
- Yang Wan
- et al.
- 2013
- ICCAD 2013
Analysis and modeling of dc current crowding for tsv-based 3-d connections and power integrity
- Xin Zhao
- Michael R. Scheuermann
- et al.
- 2014
- IEEE Transactions on CPMT
Distributed TSV topology for 3-D power-supply networks
- Michael B. Healy
- Sung Kyu Lim
- 2012
- IEEE Transactions on VLSI Systems
Integrated microarchitectural floorplanning and run-time controller for inductive noise mitigation
- Michael B. Healy
- Fayez Mohamood
- et al.
- 2011
- ACM TODAES