The use of fast integral equations solvers for practical package and interconnect analysis
- J.D. Morsey
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
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24 results for Li Jun Jiang
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach
- L. Jiang
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Solving low frequency electromagnetic problems with fast solvers
- W.C. Chew
- L. Jiang
- et al.
- 2005
- EMC 2005
The general variational formulas for capacitance parameter extraction
- W.C. Chew
- L.J. Jiangt
- 2005
- IEEE Topical Meeting EPEPS 2005
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
- J.D. Morsey
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
A rigorous approach for the radiated emission characterization based on the spherical magnetic field scanning
- Ping Li
- Li Jun Jiang
- 2014
- IEEE Trans Electromagn Compat
Finite-element-based generalized impedance boundary condition for modeling plasmonic nanostructures
- Shiquan He
- Wei E.I. Sha
- et al.
- 2012
- IEEE TNANO
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
On the dual basis for solving electromagnetic surface integral equations
- Mei Song Tong
- Weng Cho Chew
- et al.
- 2009
- IEEE Trans Antennas Propag
Pulsed EM field response of a thin, high-contrast, finely layered structure with dielectric and conductive properties
- Adrianus T. de Hoop
- Lijun Jiang
- 2009
- IEEE Trans Antennas Propag