3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
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Unassisted true analog neural network training chip
- Y. Kohda
- Y. Li
- et al.
- 2020
- IEDM 2020