3D copper TSV integration, testing and reliability
- Mukta Farooq
- T. Graves-Abe
- et al.
- 2011
- IEDM 2011
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5 results for R. Volant
Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
High performance thick copper inductors in an RF technology
- Kunal Vaed
- William Graham
- et al.
- 2004
- SPIE Micromachining and Microfabrication 2004
A resonant global clock distribution for the cell broadband engine processor
- Steven C. Chan
- Phillip J. Restle
- et al.
- 2009
- IEEE Journal of Solid-State Circuits
50-200 GHz silicon-germanium heterojunction bipolar transistor BICMOS technology and a computer-aided design environment for 2-50+GHz very large-scale integration mixed-signal ICs
- Seshadri Subbanna
- Gregory Freeman
- et al.
- 2002
- Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers