Hotspot-optimized interlayer cooling in vertically integrated packages
- 2008
- MRS Fall Meeting 2008
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6 results for H. Reichl
Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2012
- ITherm 2012
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2011
- SEMI-THERM 2011
Heat-removal performance scaling of interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2010
- ITherm 2010
Forced convective interlayer cooling in vertically integrated packages
- 2008
- ITherm 2008
Interlayer cooling potential in vertically integrated packages
- 2008
- Microsystem Technologies