Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests
- K.N. Chen
- S.M. Chang
- et al.
- 2006
- Journal of Electronic Materials
Publications
Date
Featured collections
Popular topics
22 results for K.N. Chen
The effect of forming gas anneal on the oxygen content in bonded copper layer
- C.S. Tan
- K.N. Chen
- et al.
- 2005
- Journal of Electronic Materials