64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
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4 results for Hirokazu Kato
Qualification, monitoring, and integration into a production environment of the world's first fully programmable illuminator
- Gregory McIntyre
- Daniel Corliss
- et al.
- 2011
- SPIE Advanced Lithography 2011
EUV OPC for 56 nm metal pitch
- Martin Burkhardt
- Matt Colburn
- et al.
- 2011
- SPIE Advanced Lithography 2011
Revisit pattern collapse for 14nm node and beyond
- Kenji Yoshimoto
- Craig Higgins
- et al.
- 2011
- SPIE Advanced Lithography 2011