Electromigration behavior of multilayered Al/Hf and Al/Ti fine lines and its dependence on Cu and Pd solute additions
- K.P. Rodbell
- 1992
- Microelectronics Reliability
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126 results for Ken Rodbell
Hydrogen redistribution and gettering in AlCu/Ti thin films
- A.D. Marwick
- Joyce C. Liu
- et al.
- 1991
- Journal of Applied Physics
Correlation of texture with electromigration behavior in Al metallization
- D.B. Knorr
- D.P. Tracy
- et al.
- 1991
- Applied Physics Letters
Use of a two-frequency ac bridge to measure 1/f noise in copper films
- K.P. Rodbell
- R.H. Koch
- 1991
- Physical Review B
Fine-line interactions in Al/Hf/Al thin films
- K.P. Rodbell
- K.N. Tu
- et al.
- 1991
- Physical Review B
Effect of hydrogen on electromigration and 1/f noise in gold films
- K.P. Rodbell
- P.J. Ficalora
- et al.
- 1987
- Applied Physics Letters