Publications

509 results at JES

Plating of Copper into Through-Holes and Vias
- - Richard C. Alkire
  - Lubomyr T. Romankiw
- 2019
- JES
Interaction Between ti and SiO₂
- - C.-Y. Ting
  - M. Wittmer
  - et al.
- 2019
- JES
An XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
- - N.J. Chou
  - D.W. Dong
  - et al.
- 2019
- JES
Reactive Ion Etching of PECVD Amorphous Silicon and Silicon Nitride Thin Films with Fluorocarbon Gases
- - Yue Kuo
- 2019
- JES
Plasma Etching of Silicon in SF₆: Experimental and Reactor Modeling Studies
- - Yeong-Jyh Lii
  - Jacob Jorné
  - et al.
- 2019
- JES
Low Energy Proton Beam Lithography with a Thin Oxygen-Etch Barrier Layer
- - H. Hiraoka
- 2019
- JES
Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films
- - Robert L. Jackson
- 2019
- JES
Substituent Effect on Para-Substituted n-phenylpyrrole Monomers and Their Polyheterocyclic Conductors
- - M.C. Rock
  - Ma. Eugenia Carbajal
  - et al.
- 2019
- JES
Heating Effects In Reactive Etching Of Nb And Nb₂0₅
- - Young H. Lee
- 2019
- JES
Growth of Facet-Free Selective Silicon Epitaxy at Low Temperature and Atmospheric Pressure
- - T.O. Sedgwick
  - P. Agnello
  - et al.
- 2019
- JES