Application of scatterometry to BEOL measurements: Post Cu CMP measurements
- Deepak Kulkarni
- Shorn Ponoth
- et al.
- 2007
- MRS Spring Meeting 2007
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14288 results for Physical Sciences
Improved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
Fundamental understanding and optimization of PBTI in nFETs with SiO 2/HfO2 gate stack
- E. Cartier
- B.P. Linder
- et al.
- 2006
- IEDM 2006
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
Direct silicon bonded (DSB) substrate solid phase epitaxy (SPE) integration scheme study for high performance bulk CMOS
- Haizhou Yin
- C.Y. Sung
- et al.
- 2006
- IEDM 2006
Challenges and opportunities for high performance 32 nm CMOS technology
- J. Sleight
- I. Lauer
- et al.
- 2006
- IEDM 2006
Novel enhanced stressor with graded embedded SiGe source/drain for high performance CMOS devices
- J.-P. Han
- H. Utomo
- et al.
- 2006
- IEDM 2006
Structure, design and process control for Cu bonded interconnects in 3D integrated circuits
- Kuan-Neng Chen
- Sang Hwui Lee
- et al.
- 2006
- IEDM 2006
Self-consistent and efficient electro-thermal analysis for poly/metal gate FinFETs
- Satish Kumar
- Rajiv V. Joshi
- et al.
- 2006
- IEDM 2006