Eulerian multiphase conjugate model for chip-embedded microchannel flow boiling
- Pritish R. Parida
- Hsin-Hua Tsuei
- et al.
- 2015
- InterPACK 2015
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13 results at InterPACK 2015
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015