Vacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
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16 results at ECTC 2011
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- Jae-Woong Nah
- Michael A. Gaynes
- et al.
- 2011
- ECTC 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
High performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011
Electromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011