Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP)
- Wei-Tsu Tseng
- Sana Rafie
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
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18 results at ECS J. Solid State Sci. Technol.
Challenges of tailoring surface chemistry and plasma/surface interactions to advance atomic layer etching
- Sebastian U. Engelmann
- Robert L. Bruce
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Electrical enhancement and higher-k engineering in ultra-thin atomic layer deposited Hf1-xAlxOy films
- K. Tapily
- S. Consiglio
- et al.
- 2014
- ECS J. Solid State Sci. Technol.
Toward successful integration of porous low-k materials: Strategies addressing plasma damage
- Krystelle Lionti
- Willi Volksen
- et al.
- 2014
- ECS J. Solid State Sci. Technol.
Ga46Sb54 material for fast switching and Pb-Free soldering reflow process complying phase-change memory
- Huai-Yu Cheng
- Simone Raoux
- et al.
- 2014
- ECS J. Solid State Sci. Technol.
Post cu cmp cleaning of polyurethane pad debris
- Wei-Tsu Tseng
- Elliott Rill
- et al.
- 2013
- ECS J. Solid State Sci. Technol.
CVD and ALD Co(W) films using amidinato precursors as a single-layered barrier/liner for next-generation Cu-interconnects
- Hideharu Shimizu
- Yudai Suzuki
- et al.
- 2013
- ECS J. Solid State Sci. Technol.
Integration of a manufacturing grade, k = 2.0 spin-on material in a single damascene structure
- Willi Volksen
- Sampath Purushothaman
- et al.
- 2012
- ECS J. Solid State Sci. Technol.