Through-silicon vias: Drivers, performance, and innovations
- Paragkumar A. Thadesar
- Xiaoxiong Gu
- et al.
- 2016
- IEEE Transactions on CPMT
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29 results at IEEE Transactions on CPMT
Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis
- John N. Myers
- Xiaoxian Zhang
- et al.
- 2015
- IEEE Transactions on CPMT
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2014
- IEEE Transactions on CPMT
Using via stubs in periodic structures for microwave filter design
- Andreas Hardock
- Young H. Kwark
- et al.
- 2014
- IEEE Transactions on CPMT
Analysis and modeling of dc current crowding for tsv-based 3-d connections and power integrity
- Xin Zhao
- Michael R. Scheuermann
- et al.
- 2014
- IEEE Transactions on CPMT
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2014
- IEEE Transactions on CPMT
Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- Xiaoxiong Gu
- Joel A. Silberman
- et al.
- 2013
- IEEE Transactions on CPMT
Complete modeling of large via constellations in multilayer printed circuit boards
- Sebastian Müller
- Fabian Happ
- et al.
- 2013
- IEEE Transactions on CPMT
Accurate 3-D capacitance of parallel plates from 2-D analytical superposition
- Richard E. Matick
- Albert E. Ruehli
- 2013
- IEEE Transactions on CPMT
Foreword special section on through silicon vias
- Dong Gun Kam
- Joungho Kim
- 2011
- IEEE Transactions on CPMT