Design and modeling methodology of vertical interconnects for 3DI applications
- Rachel Gordin
- David Goren
- et al.
- 2011
- IEEE Transactions on CPMT
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29 results at IEEE Transactions on CPMT
Physics-based passivity-preserving parameterized model order reduction for PEEC circuit analysis
- Francesco Ferranti
- Giulio Antonini
- et al.
- 2011
- IEEE Transactions on CPMT
Impact of organic substrate warp on C4 non-wets
- Vijay D. Khanna
- Sri M. Sri-Jayantha
- 2011
- IEEE Transactions on CPMT
Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets
- Dong Gun Kam
- Duixian Liu
- et al.
- 2011
- IEEE Transactions on CPMT
Using single-wall carbon nanotubes and raman spectroscopy to measure local stresses in first-level flip-chip organic packages
- Ijeoma Nnebe
- Soojae Park
- et al.
- 2011
- IEEE Transactions on CPMT
Integration of tantalum pentoxide capacitors with through-silicon vias
- Alphonse Kamto Tegueu
- Yang Liu
- et al.
- 2011
- IEEE Transactions on CPMT
Analysis and optimization of low-power passive equalizers for cpu-memory links
- Ling Zhang
- Wenjian Yu
- et al.
- 2011
- IEEE Transactions on CPMT
Flow boiling of R134a in a multi-microchannel heat sink with hotspot heaters for energy-efficient microelectronic CPU cooling applications
- Yassir Madhour
- Jonathan Olivier
- et al.
- 2011
- IEEE Transactions on CPMT
Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects
- Tapobrata Bandyopadhyay
- Ki Jin Han
- et al.
- 2011
- IEEE Transactions on CPMT