Flip-chip-assembled air-suspended inductors
- Patrick J. Bell
- Nilds D. Hoivik
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
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32 results at IEEE Transactions on Advanced Packaging
Simulation of coupled interconnects using waveform relaxation and transverse partitioning
- Natalie M. Nakhla
- Albert E. Ruehli
- et al.
- 2006
- IEEE Transactions on Advanced Packaging
New methodology for combined simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- Alina Deutsch
- Howard H. Smith
- et al.
- 2006
- IEEE Transactions on Advanced Packaging
Toward a more robust and accurate CEM fast integral equation solver for IC applications
- Weng Cho Chew
- Li Jun Jiang
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach
- Ullrich R. Pfeiffer
- Arun Chandrasekhar
- 2005
- IEEE Transactions on Advanced Packaging
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
- Alina Deutsch
- Thomas-Michael Winkel
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
A CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- Alina Deutsch
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis
- I.M. Abe Elfadel
- Alina Deutsch
- et al.
- 2004
- IEEE Transactions on Advanced Packaging
Transient analysis of lossy transmission lines: An efficient approach based on the method of characteristics
- Stefano Grivet-Talocia
- Hao-Ming Huang
- et al.
- 2004
- IEEE Transactions on Advanced Packaging
Characterization and performance evaluation of differential shielded cables for multi-Gb/s data-rates
- Alina Deutsch
- Gerard V. Kopcsay
- et al.
- 2002
- IEEE Transactions on Advanced Packaging