Intrinsic and Passivation-Induced Trench Tapering during Plasma Etching
- S. Hamaguchi
- M. Dalvie
- 1994
- JES
Publications
509 results at JES
Electrochemically Deposited Diffusion Barriers
- Milan Paunovic
- Robert G. Schad
- et al.
- 1994
- JES
Thin Film Transistors with Graded SiNx Gate Dielectrics
- Yue Kuo
- 1994
- JES
Shallow n+ Junctions in Silicon by Arsenic Gas-Phase Doping
- J.F. DeGeolormo
- D.K. Sodana
- et al.
- 1994
- JES
X-Ray Absorption Study of Electrochemically Grown Oxide Films on AlCr Sputtered Alloys
- A.J. Davenport
- H.S. Isaacs
- et al.
- 1994
- JES
On the Pitting Resistance of Sputter-Deposited Aluminum Alloys
- R.C. Newman
- C.V. Jahnes
- et al.
- 1993
- JES
Electrical Resistance and Stress of Bilayer Co(P)/Cu and Ni(P)/Cu Thin Films
- M. Paunovic
- L. Clevenger
- et al.
- 1993
- JES
Chemical Vapor Deposited Copper from Alkyne Stabilized Copper (I) Hexafluoroacetylacetonate Complexes
- Thomas H. Baum
- Carl E. Larson
- 1993
- JES
High-Resolution Depth Profiling of Ultrathin Silicon Oxide/Nitride/Oxide Layers
- G.M.W. Kroesen
- G.S. Oehrlein
- et al.
- 1993
- JES
Behavior of Cu(P) and Oxygen Free High Conductivity Cu Anodes under Electrodeposition Conditions
- H.S. Isaacs
- A.G. Schroft
- et al.
- 1993
- JES