Advanced metallization developments for 32-nm node CMOS technology contact architecture
- Doug H. Lee
- Valli Arunachalam
- et al.
- 2009
- ADMETA 2009
Publications
Date
Featured collections
Popular topics
3 results at ADMETA 2009
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemes
- Y.C. Ee
- D. Kioussis
- et al.
- 2009
- ADMETA 2009