Thermal resistance measurements of interconnections, for the investigation of the thermal resistance of a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Yoichi Taira
- 2009
- SEMI-THERM 2009
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3 results at SEMI-THERM 2009
Effect of inlet orifice on saturated CHF and flow visualization in multi-microchannel heat sinks
- Jung Eung Park
- John R. Thome
- et al.
- 2009
- SEMI-THERM 2009
Flow-induced spatial non-uniformity and anisotropy in electrically conductive adhesives
- Brian Smith
- Alexander Bonetti
- et al.
- 2009
- SEMI-THERM 2009