Publications

2 results at IITC 2000

Integration of copper and fluorosilicate glass for 0.18 μm interconnections
- - E. Barth
  - T. Ivers
  - et al.
- 2000
- IITC 2000
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- - R.D. Goldblatt
  - B.N. Agarwala
  - et al.
- 2000
- IITC 2000