'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects
- Muhannad S. Bakir
- Bing Dang
- et al.
- 2007
- ECTC 2007
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9 results at ECTC 2007
Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2007
- ECTC 2007
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
120 Gb/s optical card-to-card interconnect link demonstrator with embedded waveguides
- L. Dellmann
- C. Berger
- et al.
- 2007
- ECTC 2007
Electromigration study in flip chip solder joints
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- ECTC 2007
OE device integration for optically enabled MCM
- Yoichi Taira
- Hidetoshi Numata
- et al.
- 2007
- ECTC 2007
160-Gb/s bidirectional parallel optical transceiver module for board-level interconnects using a single-chip CMOS IC
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2007
- ECTC 2007
On-chip millimeter-wave library device - Scalable Wilkinson power divider/combiner
- Ding Hanyi
- Kwanhim Lam
- et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007