C4NP - First manufacturing & reliability data for high-end FlipChip solder bumping based on IBM's C4NP process
- Klaus Ruhmer
- Eric Laine
- et al.
- 2006
- GBC 2006
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3 results at GBC 2006
Critical aspects of layer transfer and alignment tolerances for 3D integration processes
- D.C. La Tulipe
- L.T. Shi
- et al.
- 2006
- GBC 2006
Building a packaging hierarchy for optical interconnects using polymer waveguides: Exploring the options
- Stephen L. Buchwalter
- Russell Budd
- et al.
- 2006
- GBC 2006