Using shadow lines to assure accurate signal return current in electrical package analysis codes
- B.I. Rubin
- 2003
- IEEE Topical Meeting EPEPS 2003
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9 results at IEEE Topical Meeting EPEPS 2003
The necesity and consequences of modeling driver and load nonlinearity in on-chip global interconnect noise verification
- Peter Feldmann
- 2003
- IEEE Topical Meeting EPEPS 2003
Including dispersive dielectrics in PEEC Models
- Giulio Antonhi
- Albert E. Ruehlis
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
- Christian Schuster
- Daniel M. Kuchta
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Extraction of ε(f) and tan δ(f) for BT Insulator up to 30 GHz Using the Short-Pulse Propagation Technique
- A. Deutsch
- T.-M. Winkel
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Understanding common-mode noise on wide data-buses
- Alina Deutsch
- Howard H. Smith
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Low-Cost ceramic BGA package for 50 Gb/s multiplexing circuit
- Lei Shan
- Jean Trewhella
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
- Ullrich Pfeiffer
- Arun Chandrasekhar
- 2003
- IEEE Topical Meeting EPEPS 2003
A CAD methodology for the characterization of wide on-chip buses
- I.M. Elfadel
- A. Deutsch
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003