Influence of sidewall roughness on the reliability of 0.20-μm Al RIE wiring
- R. Ravikumar
- H. Cichy
- et al.
- 1999
- IITC 1999
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4 results at IITC 1999
Cleans for Al vias in a 0.175 μm Dual Damascene Process
- J.P. Gambino
- L. Clevenger
- et al.
- 1999
- IITC 1999
Scaling effect on electromigration in on-chip Cu wiring
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- IITC 1999
Challenges of Aluminum RIE Technology at sub 0.45 μm Pitches
- R. Ravikumar
- R. Filippi
- et al.
- 1999
- IITC 1999