An acid-based electroless Cu deposition process: Chemical formulation, film characteristics and CMP performanceWei-Tsu TsengChia-Hsien Loet al.2000ECS Meeting 2000
Experimental studies on electrodeposition of CoFe alloysHong XuThomas E. Dinanet al.2000ECS Meeting 2000
Sub-micron platinum electrodes by through-mask platingK.L. SaengerG. Costriniet al.2000ECS Meeting 2000