Photon emission microscopy of inter/intra chip device performance variations
- S. Polonsky
- M. Bhushan
- et al.
- 2005
- ESREF 2005
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3 results at ESREF 2005
Innovative packaging technique for backside optical testing of wire-bonded chips
- A. Tosi
- F. Stellari
- et al.
- 2005
- ESREF 2005
Characterization of a 0.13 μm CMOS link chip using time resolved emission (TRE)
- Franco Stellari
- Peilin Song
- et al.
- 2005
- ESREF 2005