Package analysis tool based on a method of moments/surface formulation
- Saila Ponnapalli
- R. Bertin
- et al.
- 1993
- ECTC 1993
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5 results at ECTC 1993
Polyimides with reduced dielectric anisotropy
- Jeff W. Labadie
- H. Lee
- et al.
- 1993
- ECTC 1993
Dynamic behavior of printed wiring boards: increasing board stiffness by optimizing support locations
- A.O. Cifuentes
- A. Kalbag
- 1993
- ECTC 1993
Improvements in Index alignment method for laser-fiber array packaging
- M.S. Cohen
- M.J. DeFranza
- et al.
- 1993
- ECTC 1993
Highly optimized and robust calculation of signal propagation parameters in electronic packages
- L. Efrat
- M. Tismenetsky
- et al.
- 1993
- ECTC 1993