Exploration of inductor-based hybrid integrated voltage regulator architecturesArvind SridharThomas Brunschwileret al.2016ESTC 2016
Intra-stack sealing of tier interconnects using the interconnect alloyJessica KleffGerd Schlottiget al.2016ESTC 2016
Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channelsThomas BrunschwilerRaúl Mroßkoet al.2016ESTC 2016