Neuromorphic semiconductor memory
- Chung Lam
- 2015
- 3DIC 2015
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3 results at 3DIC 2015
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- Kuniaki Sueoka
- Akihiro Horibe
- et al.
- 2015
- 3DIC 2015
Warpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015