Characterization of particle beds in percolating thermal underfills based on centrifugation
- Severin Zimmermann
- Thomas Brunschwiler
- et al.
- 2014
- 3DIC 2014
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2 results at 3DIC 2014
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- 3DIC 2014