Analysis of TSV geometric parameter impact on switching noise in 3D power distribution network
- Huanyu He
- James J.-Q. Lu
- et al.
- 2014
- ASMC 2014
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2 results at ASMC 2014
CD-SEM metrology evaluation of gate-all-around Si nanowire MOSFET with improved control of nanowire suspension by using a buried boron nitride etch-stop layer
- Guy M. Cohen
- Leathen Shi
- et al.
- 2014
- ASMC 2014